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Concept of PIC Packaging with Microwave, DC and Fiber Array..:

, In: 2019 International Workshop on Fiber Optics in Access Networks (FOAN),
Chovan, Jozef ; Tomaska, Martin ; Uherek, Frantisek... - p. 38-41 , 2019
Link: https://doi.org/10.1109/FOAN.2019.8933777