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Mitigation of Thermal Stress Accelerants on Key Components ..:

, In: 2019 IEEE 10th Annual Information Technology, Electronics and Mobile Communication Conference (IEMCON),
Chan, S. ; Leelachariyakult, B. ; Nopphawan, P.. - p. 0851-0858 , 2019
Link: https://doi.org/10.1109/IEMCON.2019.8936286