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1 Ergebnisse
1
Failure Analysis of QFP Package Interconnection structure u..:
, In:
2019 Prognostics and System Health Management Conference (PHM-Qingdao)
,
Jiaxing, Hu
;
Bo, Jing
;
Yulin, Zhang
.. - p. 1-6 , 2019
Link:
https://doi.org/10.1109/PHM-Qingdao46334.2019.8943048
RT T1 <cTitle>2019 Prognostics and System Health Management Conference (PHM-Qingdao)</cTitle>: T1 <Title>Failure Analysis of QFP Package Interconnection structure under Random Vibration and Temperature</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8943048&Exemplar=1&LAN=DE A1 Jiaxing, Hu A1 Bo, Jing A1 Yulin, Zhang A1 Longteng, Li A1 Meng, Sun YR 2019 K1 Integrated circuit interconnections K1 Soldering K1 Vibrations K1 Reliability K1 Monitoring K1 Stress K1 Temperature measurement K1 Interconnection structure K1 Temperature K1 Random vibration K1 Failure modes K1 Location K1 Life distribution SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/PHM-Qingdao46334.2019.8943048 DO https://doi.org/10.1109/PHM-Qingdao46334.2019.8943048 SF ELIB - SuUB Bremen
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