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Behaviour of Silver-Sintered Joints by Cyclic Mechanical Lo..:
, In:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
,
Gokdeniz, Zeynep
;
Khatibi, Golta
;
Nicolics, Johann
. - p. 1-6 , 2019
Link:
https://doi.org/10.23919/EMPC44848.2019.8951762
RT T1 <cTitle>2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)</cTitle>: T1 <Title>Behaviour of Silver-Sintered Joints by Cyclic Mechanical Loading and Influence of Temperature</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8951762&Exemplar=1&LAN=DE A1 Gokdeniz, Zeynep A1 Khatibi, Golta A1 Nicolics, Johann A1 Steiger-Thirsfeld, Andreas YR 2019 K1 Silver K1 Aging K1 Stress K1 Fatigue K1 Strain K1 Bonding K1 Microstructure K1 low temperature silver sintering K1 temperature effect K1 shear strength K1 low cycle fatigue K1 lifetime SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.23919/EMPC44848.2019.8951762 DO https://doi.org/10.23919/EMPC44848.2019.8951762 SF ELIB - SuUB Bremen
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