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1 Ergebnisse
1
Thermomechanical Properties of Fan-Out Wafer Level Package ..:
, In:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
,
Jeong, Haksan
;
Jung, Kwang-Ho
;
Lee, Choong-Jae
.. - p. 1-5 , 2019
Link:
https://doi.org/10.23919/EMPC44848.2019.8951764
RT T1 <cTitle>2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)</cTitle>: T1 <Title>Thermomechanical Properties of Fan-Out Wafer Level Package Fabricated with Various Epoxy Mold Compound</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8951764&Exemplar=1&LAN=DE A1 Jeong, Haksan A1 Jung, Kwang-Ho A1 Lee, Choong-Jae A1 Min, Kyung Deuk A1 Jung, Seung-Boo YR 2019 K1 Electromagnetic compatibility K1 Silicon K1 Electronic components K1 Electronics packaging K1 Compounds K1 Thermal shock K1 Packaging K1 Fan-out package K1 Epoxy mold compound K1 Warpage K1 Temperature-humidity test K1 Thermal shock test SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.23919/EMPC44848.2019.8951764 DO https://doi.org/10.23919/EMPC44848.2019.8951764 SF ELIB - SuUB Bremen
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