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1 Ergebnisse
1
PrintPOWER - Paste systems for multifunctional copper power..:
, In:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
,
Reinhardt, K.
;
Korner, S.
;
Partsch, U.
- p. 1-7 , 2019
Link:
https://doi.org/10.23919/EMPC44848.2019.8951788
RT T1
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
: T1
PrintPOWER - Paste systems for multifunctional copper power modules
UL https://suche.suub.uni-bremen.de/peid=ieee-8951788&Exemplar=1&LAN=DE A1 Reinhardt, K. A1 Korner, S. A1 Partsch, U. YR 2019 K1 Glass K1 Insulation K1 Substrates K1 Copper K1 Metallization K1 Adhesives K1 Polymers K1 Thick-film power modules K1 copper multilayer circuits K1 high temperature pastes K1 low temperature pastes K1 rheology K1 3D dispensing SP 1 OP 7 LK http://dx.doi.org/https://doi.org/10.23919/EMPC44848.2019.8951788 DO https://doi.org/10.23919/EMPC44848.2019.8951788 SF ELIB - SuUB Bremen
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