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1 Ergebnisse
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LTCC as substrate - enabling semiconductor and packaging in..:
, In:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
,
Bartsch, Heike
;
Pezoldt, Jorg
;
Sanchez, Francico M. Morales
... - p. 1-4 , 2019
Link:
https://doi.org/10.23919/EMPC44848.2019.8951794
RT T1 <cTitle>2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)</cTitle>: T1 <Title>LTCC as substrate - enabling semiconductor and packaging integration</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8951794&Exemplar=1&LAN=DE A1 Bartsch, Heike A1 Pezoldt, Jorg A1 Sanchez, Francico M. Morales A1 Rios, Juan J. Jimenez A1 Delgado, Jose M. Manuel A1 Breiling, Jonas A1 Muller, Jens YR 2019 K1 Temperature K1 Surface morphology K1 Molecular beam epitaxial growth K1 Surface roughness K1 Rough surfaces K1 Gallium nitride K1 III-V semiconductor materials K1 Low Temperature Cofired Ceramics K1 LTCC K1 wide bandgap semiconductors K1 engineered substrates K1 layer properties K1 Substrates Design and Technologies K1 Co-firing SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.23919/EMPC44848.2019.8951794 DO https://doi.org/10.23919/EMPC44848.2019.8951794 SF ELIB - SuUB Bremen
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