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Stencil Printing and Flip-Chip Bonding for Assembly of Pixe..:
, In:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
,
Schneider, Andreas
;
Cross, Simon P.
;
Wilson, Matthew D.
... - p. 1-8 , 2019
Link:
https://doi.org/10.23919/EMPC44848.2019.8951835
RT T1 <cTitle>2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)</cTitle>: T1 <Title>Stencil Printing and Flip-Chip Bonding for Assembly of Pixelated X-ray Detectors using PCB-type Interposer and Flexible Printed Circuit Boards</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8951835&Exemplar=1&LAN=DE A1 Schneider, Andreas A1 Cross, Simon P. A1 Wilson, Matthew D. A1 Veale, Matthew C. A1 Hart, Matthew A1 Seller, Paul A1 Borri, Marcello A1 Beckett, Dan A1 Lipp, John D. YR 2019 K1 Detectors K1 Bonding K1 Flip-chip devices K1 Silicon K1 Sensor arrays K1 Wires K1 X-Ray Detector K1 Interposer K1 Multi-Material Bonding K1 Gold Ball Studding K1 Stencil Printing K1 Flip-Chip SP 1 OP 8 LK http://dx.doi.org/https://doi.org/10.23919/EMPC44848.2019.8951835 DO https://doi.org/10.23919/EMPC44848.2019.8951835 SF ELIB - SuUB Bremen
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