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Highly Thermal Conductive and Light-weight Graphene-based H..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
Wang, Nan ; Liu, Ya ; Ye, Lilei. - p. 1-4 , 2019
Link: https://doi.org/10.23919/EMPC44848.2019.8951839