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Hybrid Systems-in-Foil (HySiF) – Low Stress CFP Process for..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
Passlack, U. ; Albrecht, B. ; Harendt, C.. - p. 1-6 , 2019
Link: https://doi.org/10.23919/EMPC44848.2019.8951841