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Development of mechanically compliant flip chip interconnec..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
Wright, Daniel N. ; Belle, Branson D. ; Graff, Joachim S. - p. 1-7 , 2019
Link: https://doi.org/10.23919/EMPC44848.2019.8951849