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Characterization of Tin Pest Phenomenon in a Low Ag Content..:
, In:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
,
Illes, Balazs
;
Skwarek, Agata
;
Hurtony, Tamas
... - p. 1-5 , 2019
Link:
https://doi.org/10.23919/EMPC44848.2019.8951853
RT T1 <cTitle>2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)</cTitle>: T1 <Title>Characterization of Tin Pest Phenomenon in a Low Ag Content SAC Solder Alloy</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8951853&Exemplar=1&LAN=DE A1 Illes, Balazs A1 Skwarek, Agata A1 Hurtony, Tamas A1 Krammer, Oliver A1 Harsanyi, Gabor A1 Witek, Krzysztof YR 2019 K1 soldering K1 tin pest K1 SAC alloy K1 inoculator K1 allotrope transition SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.23919/EMPC44848.2019.8951853 DO https://doi.org/10.23919/EMPC44848.2019.8951853 SF ELIB - SuUB Bremen
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