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Novell embedded microbump approach for die-to-die and wafer..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),

Derakhshandeh, J. ; Beyne, E. ; Capuz, G.... - p. 1-6 , 2019

Link: https://doi.org/10.23919/EMPC44848.2019.8951856

RT 
T1 <cTitle>2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)</cTitle>: T1 <Title>Novell embedded microbump approach for die-to-die and wafer-to-wafer interconnects with variable microbump diameters and down to 5 um interconnect pitch scaling</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-8951856&Exemplar=1&LAN=DE
				
A1 Derakhshandeh, J.
A1 Beyne, E.
A1 Capuz, G.
A1 Inoue, F.
A1 Cherman, V.
A1 De Preter, I.
A1 Duval, F.
A1 Slabbekoorn, J.
A1 Gerets, C.
A1 Heyvaert, C.
A1 Beirnaert, F.
A1 Cochet, T.
A1 Bex, P.
A1 Hou, L.
A1 Lofrano, M.
A1 Jamieson, G.
A1 Heylen, N.
A1 Suhard, S.
A1 Honore, M.
A1 Webers, T.
A1 Bertheau, J.
A1 Phommahaxay, A.
A1 Van der Plas, G.
A1 Rebibis, K. J.
A1 Miller, A.
A1 Beyer, G.
YR 2019
K1 Polymers
K1 Bonding
K1 Surface topography
K1 Metals
K1 Planarization
K1 Rough surfaces
K1 3D Stacking
K1 Embedded Bumps
K1 Fine Pitch Microbumps
K1 TCB
K1 Imc Growth Rate
SP 1
OP 6
LK http://dx.doi.org/https://doi.org/10.23919/EMPC44848.2019.8951856
DO https://doi.org/10.23919/EMPC44848.2019.8951856
SF ELIB - SuUB Bremen

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