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1 Ergebnisse
1
Advanced Interconnection technology with Laser Assisted Bon..:
, In:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
,
EOM, Yong-Sung
;
JANG, Ki-Seok
;
JOO, Jiho
. - p. 1-5 , 2019
Link:
https://doi.org/10.23919/EMPC44848.2019.8951858
RT T1 <cTitle>2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)</cTitle>: T1 <Title>Advanced Interconnection technology with Laser Assisted Bonding Process for PET Substrate</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8951858&Exemplar=1&LAN=DE A1 EOM, Yong-Sung A1 JANG, Ki-Seok A1 JOO, Jiho A1 CHOI, Kwang-Seong YR 2019 K1 Substrates K1 Temperature measurement K1 Light emitting diodes K1 Measurement by laser beam K1 Bonding K1 Wavelength measurement K1 laser K1 interconnection K1 bonding K1 reflow K1 pet SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.23919/EMPC44848.2019.8951858 DO https://doi.org/10.23919/EMPC44848.2019.8951858 SF ELIB - SuUB Bremen
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