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1 Ergebnisse
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Hermetic and Radiation Tolerant Glass Package for VCSELs Us..:
, In:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
,
Lunden, H.
;
Maattanen, A.
;
Oxtoby, I.
- p. 1-5 , 2019
Link:
https://doi.org/10.23919/EMPC44848.2019.8951865
RT T1 <cTitle>2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)</cTitle>: T1 <Title>Hermetic and Radiation Tolerant Glass Package for VCSELs Using Novel Micro Bonding Method</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8951865&Exemplar=1&LAN=DE A1 Lunden, H. A1 Maattanen, A. A1 Oxtoby, I. YR 2019 K1 Glass K1 hermetic K1 VCSEL K1 all-in-glass packaging SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.23919/EMPC44848.2019.8951865 DO https://doi.org/10.23919/EMPC44848.2019.8951865 SF ELIB - SuUB Bremen
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