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Glass Wafer Level Packaging Enabled by Laser Induced Deep E..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
Delrue, Jean-Pol ; Ostholt, Roman ; Ambrosius, Norbert - p. 1-5 , 2019
Link: https://doi.org/10.23919/EMPC44848.2019.8951876