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1 Ergebnisse
1
mmWave Antenna Design in Advanced Fan-Out Technology for 5G..:
, In:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
,
Hsieh, Sheng-Chi
;
Chu, Fu-Chen.
;
Ho, Cheng-Yu
. - p. 1-4 , 2019
Link:
https://doi.org/10.23919/EMPC44848.2019.8951882
RT T1 <cTitle>2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)</cTitle>: T1 <Title>mmWave Antenna Design in Advanced Fan-Out Technology for 5G Application</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8951882&Exemplar=1&LAN=DE A1 Hsieh, Sheng-Chi A1 Chu, Fu-Chen. A1 Ho, Cheng-Yu A1 Wang, Chen-Chao YR 2019 K1 Antenna arrays K1 Patch antennas K1 Bandwidth K1 Broadband antennas K1 Antenna feeds K1 5G mobile communication K1 28 GHz 5G systems K1 flip-chip ball grid array (FCBGA) package K1 flip chip chip scale (FCCSP) package K1 Fan out wafer level chip scale package (Fan-out WLP) K1 Advanced single sided substrates (fan-out package) K1 Antenna in package (AiP) SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.23919/EMPC44848.2019.8951882 DO https://doi.org/10.23919/EMPC44848.2019.8951882 SF ELIB - SuUB Bremen
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