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1 Ergebnisse
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Recovery of valuable BGA components from used electronic mo..:
, In:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
,
Koscielski, Marek
;
Sitek, Janusz
;
Ciszewski, Piotr
... - p. 1-5 , 2019
Link:
https://doi.org/10.23919/EMPC44848.2019.8951884
RT T1 <cTitle>2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)</cTitle>: T1 <Title>Recovery of valuable BGA components from used electronic mobile devices and their application in new electronic products</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8951884&Exemplar=1&LAN=DE A1 Koscielski, Marek A1 Sitek, Janusz A1 Ciszewski, Piotr A1 Dawidowicz, Piotr A1 Arazna, Aneta A1 Janeczek, Kamil A1 Steplewski, Wojciech A1 Podhradsky, Gerhard A1 Ambrosch, Roland YR 2019 K1 Soldering K1 Aging K1 Compounds K1 Stress K1 Standards K1 Mobile handsets K1 BGA chip recovery K1 circular economy K1 reuse K1 repair K1 IMC (intermetallic compounds) K1 disassembly K1 printed circuit boards K1 reliability tests SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.23919/EMPC44848.2019.8951884 DO https://doi.org/10.23919/EMPC44848.2019.8951884 SF ELIB - SuUB Bremen
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