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New approach to apply 1,2,3-benzotriazole as a capping laye..:
, In:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
,
Shehzad, Adil
;
Derakhshandeh, Jaber
;
Wunderle, Bernhard
... - p. 1-8 , 2019
Link:
https://doi.org/10.23919/EMPC44848.2019.8951885
RT T1 <cTitle>2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)</cTitle>: T1 <Title>New approach to apply 1,2,3-benzotriazole as a capping layer on UBMs for 3D TCB stacking and investigation of oxidation protection and solder wetting</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8951885&Exemplar=1&LAN=DE A1 Shehzad, Adil A1 Derakhshandeh, Jaber A1 Wunderle, Bernhard A1 Hou, Lin A1 Suhard, Samuel A1 Rebibis, Kenneth June A1 Miller, Andy A1 Beyer, Gerald A1 Beyne, Eric YR 2019 K1 Oxidation K1 Bonding K1 Three-dimensional displays K1 Copper K1 Surface treatment K1 Stacking K1 Coatings K1 Benzotriazole K1 Corrosion inhibitor K1 Oxidation protection K1 Wettability K1 3D Interconnects K1 Capping layer SP 1 OP 8 LK http://dx.doi.org/https://doi.org/10.23919/EMPC44848.2019.8951885 DO https://doi.org/10.23919/EMPC44848.2019.8951885 SF ELIB - SuUB Bremen
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