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Hybrid Cu particle paste with surface-modified particles fo..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
Bhogaraju, Sri Krishna ; Mokhtari, Omid ; Pascucci, Jacopo... - p. 1-8 , 2019
Link: https://doi.org/10.23919/EMPC44848.2019.8951887