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1 Ergebnisse
1
A Low-Complex Compressive Sensing Based Thermal Sensor Plac..:
, In:
2019 17th IEEE International New Circuits and Systems Conference (NEWCAS)
,
Chen, Kun-Chih
;
Tang, Hsueh-Wen
- p. 1-4 , 2019
Link:
https://doi.org/10.1109/NEWCAS44328.2019.8961281
RT T1 <cTitle>2019 17th IEEE International New Circuits and Systems Conference (NEWCAS)</cTitle>: T1 <Title>A Low-Complex Compressive Sensing Based Thermal Sensor Placement for Multicore Systems</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8961281&Exemplar=1&LAN=DE A1 Chen, Kun-Chih A1 Tang, Hsueh-Wen YR 2019 K1 compressive sensing K1 sensor placement K1 multicore system SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/NEWCAS44328.2019.8961281 DO https://doi.org/10.1109/NEWCAS44328.2019.8961281 SF ELIB - SuUB Bremen
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