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TEM-EDX Line Scan to Investigate O2 Diffusion across Physic..:

, In: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA),
Wai, Wan Tatt ; Jia Sheng, Ong ; Jia, Loh Yeong. - p. 1-4 , 2019
Link: https://doi.org/10.1109/IPFA47161.2019.8984765