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Using Microprobe to enhance Die Level Static Fault Isolatio..:

, In: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA),
Nagalingam, D. ; Quah, A.C.T. ; Moon, S.J.... - p. 1-5 , 2019
Link: https://doi.org/10.1109/IPFA47161.2019.8984821