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1 Ergebnisse
1
Study of Silicon thickness for electron transparency:
, In:
2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)
,
HK, Tan
;
BH, Liu
;
ML, Chooi
.. - p. 1-4 , 2019
Link:
https://doi.org/10.1109/IPFA47161.2019.8984844
RT T1
2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)
: T1
Study of Silicon thickness for electron transparency
UL https://suche.suub.uni-bremen.de/peid=ieee-8984844&Exemplar=1&LAN=DE A1 HK, Tan A1 BH, Liu A1 ML, Chooi A1 YN, Hua A1 XM, Li YR 2019 SN 1946-1550 K1 TEM sample preperation K1 FIB K1 SEM K1 EDX K1 Silicon thickness SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IPFA47161.2019.8984844 DO https://doi.org/10.1109/IPFA47161.2019.8984844 SF ELIB - SuUB Bremen
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