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A study on an abnormal oxidation issue of copper bonding wi..:

, In: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA),
Jinzhi, Lois Liao ; Jianbo, Song ; Lei, Zhu... - p. 1-5 , 2019
Link: https://doi.org/10.1109/IPFA47161.2019.8984848