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Failure Analysis on TiAl Metallization Process for Ohmic Co..:

, In: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA),
Hung, Chia-Lung ; Cheng, Jung-Chien ; Tsui, Bing-Yue - p. 1-4 , 2019
Link: https://doi.org/10.1109/IPFA47161.2019.8984917