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A Novel Structural Design Serving as a Stress Relief Layer ..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Wang, Yu-Xuan ; Chang, Ting-Chang ; Huang, Shin-Ping... - p. 8.3.1-8.3.4 , 2019
Link: https://doi.org/10.1109/IEDM19573.2019.8993456