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1 Ergebnisse
1
Non-Planarization Cu-Cu Direct Bonding and Gang Bonding wit..:
, In:
2019 IEEE International Electron Devices Meeting (IEDM)
,
Chou, Tzu-Chieh
;
Yang, Kai-Ming
;
Li, Jian-Chen
... - p. 5.5.1-5.5.4 , 2019
Link:
https://doi.org/10.1109/IEDM19573.2019.8993544
RT T1 <cTitle>2019 IEEE International Electron Devices Meeting (IEDM)</cTitle>: T1 <Title>Non-Planarization Cu-Cu Direct Bonding and Gang Bonding with Low Temperature and Short Duration in Ambient Atmosphere</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8993544&Exemplar=1&LAN=DE A1 Chou, Tzu-Chieh A1 Yang, Kai-Ming A1 Li, Jian-Chen A1 Yu, Ting-Yang A1 Chung, Ying-Ting A1 Ko, Cheng-Ta A1 Chen, Yu-Hua A1 Tseng, Tzyy-Jang A1 Chen, Kuan-Neng YR 2019 SN 2156-017X SP 5.5.1 OP 5.5.4 LK http://dx.doi.org/https://doi.org/10.1109/IEDM19573.2019.8993544 DO https://doi.org/10.1109/IEDM19573.2019.8993544 SF ELIB - SuUB Bremen
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