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1 Ergebnisse
1
Heterogeneous Integration Using Omni-Directional Interconne..:
, In:
2019 IEEE International Electron Devices Meeting (IEDM)
,
Elsherbini, A. A.
;
Liff, S. M.
;
Swan, J. M.
- p. 19.4.1-19.4.4 , 2019
Link:
https://doi.org/10.1109/IEDM19573.2019.8993659
RT T1 <cTitle>2019 IEEE International Electron Devices Meeting (IEDM)</cTitle>: T1 <Title>Heterogeneous Integration Using Omni-Directional Interconnect Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8993659&Exemplar=1&LAN=DE A1 Elsherbini, A. A. A1 Liff, S. M. A1 Swan, J. M. YR 2019 SN 2156-017X SP 19.4.1 OP 19.4.4 LK http://dx.doi.org/https://doi.org/10.1109/IEDM19573.2019.8993659 DO https://doi.org/10.1109/IEDM19573.2019.8993659 SF ELIB - SuUB Bremen
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