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1 Ergebnisse
1
Dual Side Molding SiP Drop Reliability Analysis:
, In:
2019 IEEE CPMT Symposium Japan (ICSJ)
,
Lai, Wei-Hong
;
Chen, Ryan
;
Liao, Tse-Wei
... - p. 55-58 , 2019
Link:
https://doi.org/10.1109/ICSJ47124.2019.8998752
RT T1
2019 IEEE CPMT Symposium Japan (ICSJ)
: T1
Dual Side Molding SiP Drop Reliability Analysis
UL https://suche.suub.uni-bremen.de/peid=ieee-8998752&Exemplar=1&LAN=DE A1 Lai, Wei-Hong A1 Chen, Ryan A1 Liao, Tse-Wei A1 Chen, RichardYC A1 Shih, Meng-Kai A1 Yeh, Chan-Lin YR 2019 SN 2475-8418 K1 Soldering K1 Stress K1 Finite element analysis K1 Reliability K1 Compounds K1 Substrates K1 Shape K1 SiP K1 reliability K1 board level drop K1 finite element method SP 55 OP 58 LK http://dx.doi.org/https://doi.org/10.1109/ICSJ47124.2019.8998752 DO https://doi.org/10.1109/ICSJ47124.2019.8998752 SF ELIB - SuUB Bremen
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