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1 Ergebnisse
1
Panel Level Packaging - From Idea to Industrialization -:
, In:
2019 IEEE CPMT Symposium Japan (ICSJ)
,
Braun, T.
;
Becker, K.-F.
;
Hoelck, O.
... - p. 85-87 , 2019
Link:
https://doi.org/10.1109/ICSJ47124.2019.8998753
RT T1
2019 IEEE CPMT Symposium Japan (ICSJ)
: T1
Panel Level Packaging - From Idea to Industrialization -
UL https://suche.suub.uni-bremen.de/peid=ieee-8998753&Exemplar=1&LAN=DE A1 Braun, T. A1 Becker, K.-F. A1 Hoelck, O. A1 Voges, S. A1 Boettcher, L. A1 Topper, M. A1 Stobbe, L. A1 Aschenbrenner, R. A1 Voitel, M. A1 Schneider-Ramelow, M. A1 Lang, K.-D. YR 2019 SN 2475-8418 K1 Packaging K1 Market research K1 Polymers K1 Wafer scale integration K1 Liquid crystal displays K1 Manufacturing K1 Reliability K1 Panel Level Packaging K1 Embedding K1 Fan-out Wafer Level Packaging K1 Fan-out Panel Level Packaging SP 85 OP 87 LK http://dx.doi.org/https://doi.org/10.1109/ICSJ47124.2019.8998753 DO https://doi.org/10.1109/ICSJ47124.2019.8998753 SF ELIB - SuUB Bremen
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