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Enhanced Power and Signal Integrity Through Layout Optimiza..:

, In: 2019 Electrical Design of Advanced Packaging and Systems (EDAPS),
Weng, Pei-Yang ; Cheng, Chi-Hsuan ; Wu, Tzong-Lin... - p. 1-3 , 2019
Link: https://doi.org/10.1109/EDAPS47854.2019.9011625