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1 Ergebnisse
1
High Q-factor 3D Solenoid Inductor on InFO Package for RF S..:
, In:
2019 Electrical Design of Advanced Packaging and Systems (EDAPS)
,
Tang, Tzu-Chun
;
Lin, Chia-Chia
;
Hsu, Che-Wei
... - p. 1-3 , 2019
Link:
https://doi.org/10.1109/EDAPS47854.2019.9011648
RT T1
2019 Electrical Design of Advanced Packaging and Systems (EDAPS)
: T1
High Q-factor 3D Solenoid Inductor on InFO Package for RF System Integration
UL https://suche.suub.uni-bremen.de/peid=ieee-9011648&Exemplar=1&LAN=DE A1 Tang, Tzu-Chun A1 Lin, Chia-Chia A1 Hsu, Che-Wei A1 Lu, Chun-Lin A1 Tsai, Chung-Hao A1 Wu, Kai-Chiang A1 Pu, Han-Ping A1 Liu, Chung-Shi A1 Wang, Chuei-Tang A1 Yu, Doug YR 2019 SN 2151-1233 K1 Inductors K1 Three-dimensional displays K1 Q-factor K1 Solenoids K1 Inductance K1 Radio frequency K1 Couplings K1 3D solenoid inductor K1 Integrated fan-out package SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/EDAPS47854.2019.9011648 DO https://doi.org/10.1109/EDAPS47854.2019.9011648 SF ELIB - SuUB Bremen
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