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Dielectric Characterization of Printed Circuit Board by Mic..:

, In: 2019 Electrical Design of Advanced Packaging and Systems (EDAPS),
Huang, Chien-Chang ; Peng, Chang-Lin ; Lin, Po-Yen... - p. 1-3 , 2019
Link: https://doi.org/10.1109/EDAPS47854.2019.9011652