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1 Ergebnisse
1
Multiphysics Approach Using Computational Fluid Dynamics fo..:
, In:
2019 Electrical Design of Advanced Packaging and Systems (EDAPS)
,
Pathania, Sunil
;
Vasa, Mallikarjun
;
Shrivastava, Ashish
... - p. 1-3 , 2019
Link:
https://doi.org/10.1109/EDAPS47854.2019.9011670
RT T1 <cTitle>2019 Electrical Design of Advanced Packaging and Systems (EDAPS)</cTitle>: T1 <Title>Multiphysics Approach Using Computational Fluid Dynamics for Signal Integrity Analysis in High Speed Serial Links</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9011670&Exemplar=1&LAN=DE A1 Pathania, Sunil A1 Vasa, Mallikarjun A1 Shrivastava, Ashish A1 Kumar, Sanjay A1 Kumar, Vijender A1 Muthusamy, Sukumar A1 Seema, P K A1 Mutnury, Bhyrav A1 Sharma, Rohit YR 2019 SN 2151-1233 K1 Integrated circuit interconnections K1 Computational fluid dynamics K1 Temperature K1 Heating systems K1 Solid modeling K1 Analytical models K1 Computational modeling K1 PCB K1 CFD K1 thermal K1 Co-analysis SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/EDAPS47854.2019.9011670 DO https://doi.org/10.1109/EDAPS47854.2019.9011670 SF ELIB - SuUB Bremen
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