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1 Ergebnisse
1
Electrical and Thermal Co-Analysis of Thermally Efficient S..:
, In:
2019 Electrical Design of Advanced Packaging and Systems (EDAPS)
,
Kim, Sang Kyu
;
Oh, DanKyung Suk
;
Hwang, Seungtae
... - p. 1-3 , 2019
Link:
https://doi.org/10.1109/EDAPS47854.2019.9011675
RT T1
2019 Electrical Design of Advanced Packaging and Systems (EDAPS)
: T1
Electrical and Thermal Co-Analysis of Thermally Efficient SiP for High Performance Applications
UL https://suche.suub.uni-bremen.de/peid=ieee-9011675&Exemplar=1&LAN=DE A1 Kim, Sang Kyu A1 Oh, DanKyung Suk A1 Hwang, Seungtae A1 Lee, Bang Weon A1 Cha, Seung Yong A1 Kim, Tae Hun YR 2019 SN 2151-1233 K1 Electromagnetic compatibility K1 Electronic packaging thermal management K1 Thermal conductivity K1 Random access memory K1 Thermal management K1 Heating systems K1 Silicon K1 AI K1 5G K1 SiP K1 signal integrity K1 power integrity K1 thermal management SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/EDAPS47854.2019.9011675 DO https://doi.org/10.1109/EDAPS47854.2019.9011675 SF ELIB - SuUB Bremen
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