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Fast Physical Verification for 16nm Package Electrical Perf..:

, In: 2019 Electrical Design of Advanced Packaging and Systems (EDAPS),
Shi, Hong ; Lee, Chao-Chin ; Chu, Chia-Hui... - p. 1-3 , 2019
Link: https://doi.org/10.1109/EDAPS47854.2019.9011678