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1 Ergebnisse
1
Dynamic Thermal-Aware Inter-Layer Perpendicular Downward Ma..:
, In:
2019 IEEE 8th Global Conference on Consumer Electronics (GCCE)
,
Lin, Shu-Yen
;
Lin, Jin-Yi
- p. 527-528 , 2019
Link:
https://doi.org/10.1109/GCCE46687.2019.9015268
RT T1
2019 IEEE 8th Global Conference on Consumer Electronics (GCCE)
: T1
Dynamic Thermal-Aware Inter-Layer Perpendicular Downward Mapping for Three-Dimensional Convolutional Neural Network Accelerator
UL https://suche.suub.uni-bremen.de/peid=ieee-9015268&Exemplar=1&LAN=DE A1 Lin, Shu-Yen A1 Lin, Jin-Yi YR 2019 K1 Three-dimensional displays K1 Thermal management K1 Convolutional neural networks K1 Conferences K1 Heat sinks K1 neural network K1 3D IC K1 thermal mapping SP 527 OP 528 LK http://dx.doi.org/https://doi.org/10.1109/GCCE46687.2019.9015268 DO https://doi.org/10.1109/GCCE46687.2019.9015268 SF ELIB - SuUB Bremen
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