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Study on Preparation and Application of Nano-copper Powder ..:
, In:
2019 16th China International Forum on Solid State Lighting & 2019 International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)
,
Pan, Xu
;
Wang, Ligen
;
Qi, Fengcai
... - p. 54-58 , 2019
Link:
https://doi.org/10.1109/SSLChinaIFWS49075.2019.9019790
RT T1 <cTitle>2019 16th China International Forum on Solid State Lighting & 2019 International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)</cTitle>: T1 <Title>Study on Preparation and Application of Nano-copper Powder for Power Semiconductor Device Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9019790&Exemplar=1&LAN=DE A1 Pan, Xu A1 Wang, Ligen A1 Qi, Fengcai A1 Zhou, Youzhi A1 Zhou, Jiacheng A1 Zhang, Jingguo A1 Zhao, Zhaohui A1 Liang, Minghui A1 Ye, Huaiyu A1 Hu, Qiang A1 He, Huijun A1 Wang, Limin YR 2019 K1 Copper K1 Powders K1 Nanoscale devices K1 Morphology K1 Silver K1 Carbon K1 Nano-copper powder K1 Nano-copper paste K1 The sintering properties SP 54 OP 58 LK http://dx.doi.org/https://doi.org/10.1109/SSLChinaIFWS49075.2019.9019790 DO https://doi.org/10.1109/SSLChinaIFWS49075.2019.9019790 SF ELIB - SuUB Bremen
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