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1
The Research and Application of Thermal Performance Evaluat..:
, In:
2019 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE)
,
Zhu, Jia-Wei
;
Wang, Jing
;
Li, Qian
... - p. 313-321 , 2019
Link:
https://doi.org/10.1109/QR2MSE46217.2019.9021128
RT T1 <cTitle>2019 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE)</cTitle>: T1 <Title>The Research and Application of Thermal Performance Evaluation Test Design Method for Electronic Products Based on the Worst Conditions</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9021128&Exemplar=1&LAN=DE A1 Zhu, Jia-Wei A1 Wang, Jing A1 Li, Qian A1 Ye, Zhi-Peng A1 Lei, Bai-Mao A1 Li, Ya-Qiu A1 Mo, Bing YR 2019 K1 Thermal analysis K1 Performance evaluation K1 Thermal stresses K1 Employee welfare K1 Stress K1 Design methodology K1 thermal performance K1 evaluation test K1 electronic products K1 worst conditions SP 313 OP 321 LK http://dx.doi.org/https://doi.org/10.1109/QR2MSE46217.2019.9021128 DO https://doi.org/10.1109/QR2MSE46217.2019.9021128 SF ELIB - SuUB Bremen
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