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Study on Lifetime Model of Power Devices Based on Junction ..:
, In:
2019 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE)
,
Chen, Yuan
;
Zhang, Peng
;
Hou, Bo
. - p. 84-89 , 2019
Link:
https://doi.org/10.1109/QR2MSE46217.2019.9021225
RT T1 <cTitle>2019 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE)</cTitle>: T1 <Title>Study on Lifetime Model of Power Devices Based on Junction Temperature</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9021225&Exemplar=1&LAN=DE A1 Chen, Yuan A1 Zhang, Peng A1 Hou, Bo A1 Huang, Hong-Zhong YR 2019 K1 Junctions K1 Mathematical model K1 Predictive models K1 Thermal resistance K1 Stress K1 Reliability K1 power device K1 power cycling K1 lifetime model K1 thermal resistance K1 junction temperature SP 84 OP 89 LK http://dx.doi.org/https://doi.org/10.1109/QR2MSE46217.2019.9021225 DO https://doi.org/10.1109/QR2MSE46217.2019.9021225 SF ELIB - SuUB Bremen
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