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1 Ergebnisse
1
Thermal Fatigue Life of Copper-Filled Laminated Micropore B..:
, In:
2019 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE)
,
Li, Xiao-Xiao
;
Sun, Yu-Feng
;
Zhao, Guang-Yan
- p. 1-7 , 2019
Link:
https://doi.org/10.1109/QR2MSE46217.2019.9021261
RT T1 <cTitle>2019 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE)</cTitle>: T1 <Title>Thermal Fatigue Life of Copper-Filled Laminated Micropore Based on Response Surface Methodology</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9021261&Exemplar=1&LAN=DE A1 Li, Xiao-Xiao A1 Sun, Yu-Feng A1 Zhao, Guang-Yan YR 2019 K1 Response surface methodology K1 Fatigue K1 Analytical models K1 Data models K1 Surface treatment K1 Dielectrics K1 HDI board K1 Copper-filled Micropore K1 Microvoid K1 Thermal Fatigue Failure K1 Response Surface Methodology SP 1 OP 7 LK http://dx.doi.org/https://doi.org/10.1109/QR2MSE46217.2019.9021261 DO https://doi.org/10.1109/QR2MSE46217.2019.9021261 SF ELIB - SuUB Bremen
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