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1 Ergebnisse
1
A Novel Horizontal Copper Pattern Plating System with High ..:
, In:
2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Ozkok, Mustafa
;
Schatz, Andreas
;
Ozkok, Akif
.. - p. 92-95 , 2019
Link:
https://doi.org/10.1109/IMPACT47228.2019.9024956
RT T1 <cTitle>2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>A Novel Horizontal Copper Pattern Plating System with High Throughput</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9024956&Exemplar=1&LAN=DE A1 Ozkok, Mustafa A1 Schatz, Andreas A1 Ozkok, Akif A1 Hubner, Henning A1 Chien, Simon YR 2019 SN 2150-5942 K1 Plating K1 Copper K1 Electrolytes K1 Fluids K1 Filling K1 Crystals K1 Substrates SP 92 OP 95 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT47228.2019.9024956 DO https://doi.org/10.1109/IMPACT47228.2019.9024956 SF ELIB - SuUB Bremen
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