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Transient Thermal Damage Simulation for Novel Location-Cont..:

, In: 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Chen, Pin-Jun ; Shen, Chih-Ming ; Yang, Chih-Chao... - p. 104-107 , 2019
Link: https://doi.org/10.1109/IMPACT47228.2019.9024960