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1 Ergebnisse
1
Coupled Hygro-Thermo-Mechanical Analysis of Moisture Induce..:
, In:
2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Wu, Ji-Yen
;
Chen, Ting-Wen
;
Chiu, Tz-Cheng
... - p. 76-79 , 2019
Link:
https://doi.org/10.1109/IMPACT47228.2019.9024983
RT T1 <cTitle>2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>Coupled Hygro-Thermo-Mechanical Analysis of Moisture Induced Interfacial Stresses in Fan-Out Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9024983&Exemplar=1&LAN=DE A1 Wu, Ji-Yen A1 Chen, Ting-Wen A1 Chiu, Tz-Cheng A1 Chen, Dao-Long A1 Chen, Tang-Yuan A1 Shih, Meng-Kai YR 2019 SN 2150-5942 K1 Moisture K1 Stress K1 Absorption K1 Electromagnetic compatibility K1 Fitting K1 Numerical models K1 Finite element analysis K1 fan-out K1 epoxy molding compound K1 finite element K1 water absorption K1 moisture sensitivity level SP 76 OP 79 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT47228.2019.9024983 DO https://doi.org/10.1109/IMPACT47228.2019.9024983 SF ELIB - SuUB Bremen
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