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1 Ergebnisse
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A Composite Structure of Low Dielectric Substrate for 5G mm..:
, In:
2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Lee, Wei-Chih
;
Du, Bo-Sian
- p. 108-111 , 2019
Link:
https://doi.org/10.1109/IMPACT47228.2019.9024992
RT T1
2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
: T1
A Composite Structure of Low Dielectric Substrate for 5G mmWave and the Application in Flexible Printed Circuit (FPC)
UL https://suche.suub.uni-bremen.de/peid=ieee-9024992&Exemplar=1&LAN=DE A1 Lee, Wei-Chih A1 Du, Bo-Sian YR 2019 SN 2150-5942 K1 Substrates K1 Insertion loss K1 Dielectrics K1 Copper K1 Moisture K1 5G mobile communication K1 Absorption SP 108 OP 111 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT47228.2019.9024992 DO https://doi.org/10.1109/IMPACT47228.2019.9024992 SF ELIB - SuUB Bremen
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