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A Robust Palladium-Free Activation Process for Electroless ..:
, In:
2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Beyer, Andre
;
Zarwell, Sebastian
;
Gaida, Josef
... - p. 88-91 , 2019
Link:
https://doi.org/10.1109/IMPACT47228.2019.9024994
RT T1 <cTitle>2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>A Robust Palladium-Free Activation Process for Electroless Copper Plating</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9024994&Exemplar=1&LAN=DE A1 Beyer, Andre A1 Zarwell, Sebastian A1 Gaida, Josef A1 Gregoriades, Laurence J. A1 Kempa, Stefan A1 Kirbs, Andreas A1 Knaup, Jan A1 Lehmann, Julia A1 Stamp, Lutz A1 Welz, Yvonne YR 2019 SN 2150-5942 K1 Copper K1 Plating K1 Palladium K1 Temperature measurement K1 Oxidation K1 Universal Serial Bus SP 88 OP 91 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT47228.2019.9024994 DO https://doi.org/10.1109/IMPACT47228.2019.9024994 SF ELIB - SuUB Bremen
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