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High Power Large Size HFCBGA Thermal Characterization:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Hu, Ian ; Tsai, Jung-Che ; Cheng, Frank... - p. 467-471 , 2019
Link: https://doi.org/10.1109/EPTC47984.2019.9026583