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Determination of the Complex Thermal Characteristics of Dis..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Rencz, M. ; Poppe, A. ; Farkas, G. - p. 472-478 , 2019
Link: https://doi.org/10.1109/EPTC47984.2019.9026589