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1 Ergebnisse
1
Study on the Method to Analyze the Electrical Contact Resis..:
, In:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)
,
Wang, Xiao
;
Li, Hui
;
Yao, Ran
... - p. 613-617 , 2019
Link:
https://doi.org/10.1109/EPTC47984.2019.9026591
RT T1 <cTitle>2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Study on the Method to Analyze the Electrical Contact Resistances of Press-Pack IGBT devices</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9026591&Exemplar=1&LAN=DE A1 Wang, Xiao A1 Li, Hui A1 Yao, Ran A1 Long, Haiyang A1 Zhong, Yi A1 Yu, Renze A1 Li, Jinyuan YR 2019 SP 613 OP 617 LK http://dx.doi.org/https://doi.org/10.1109/EPTC47984.2019.9026591 DO https://doi.org/10.1109/EPTC47984.2019.9026591 SF ELIB - SuUB Bremen
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